Insights
Metrology Solutions
Wafer Warpage/Thin Film Stress Measurement System Stress Mapper
System Functions：
- Wafer warpage parameter measurement: Bow, Warp
- Thin film stress measurement: Stress (comparable to KLA Toho and FSM thin film stress meters)
Test Objects：
- Si wafers, compound wafers (SiC, GaAs, etc.), transparent wafers
Advantages ：
- Dense sampling over the entire wafer diameter, no interpolation required
- High measurement efficiency, no motorized scanning required
- Capable of measuring warpage of transparent and patterned wafers